Audited 31 Jul 2026·Last updated 15 Sept 2026·3 citations·Tier 3·0 uses

Intrinsic Carrier Concentration Calculator

Intrinsic carrier concentration calculator: nᵢ = √(N_cN_v)·exp(−E_g/2k_BT). See how band gap and temperature set a pure semiconductor's carrier density.

Intrinsic Carrier Concentration Calculator

m⁻³
m⁻³
eV
K
Intrinsic carrier concentration
6,675,898,717,280,000
Result of n_i = sqrt(N_cN_v) exp[-E_g/(2k_BT)] using the entered coherent-SI magnitudes.
Model scope
Nondegenerate equilibrium semiconductor expression with entered effective states and band gap; it does not choose material parameters or model doping, band-gap narrowing, incomplete ionization, defects, nonequilibrium carriers, or quantum confinement.

Background.

A perfectly pure semiconductor still conducts — a little. Thermal agitation constantly shakes electrons across the band gap, leaving holes behind, and the equilibrium density of those thermally created pairs is the intrinsic carrier concentration: nᵢ = √(N_cN_v)·exp(−E_g/2k_BT). It is the reference against which all doping is measured and the quantity that sets how ‘semi’ a semiconductor is.

The exponential is the whole story of semiconductor diversity. At room temperature, k_BT ≈ 25.9 meV, so a band gap of an electronvolt costs the exponential a factor of e⁻²² or so. Silicon (E_g = 1.12 eV) lands near 10¹⁰ carriers per cm³ — one thermally freed electron per ten trillion atoms. Germanium's smaller 0.66 eV gap yields a thousandfold more; wide-gap GaN (3.4 eV) essentially none, which is why it withstands high temperatures and voltages that would turn silicon intrinsically conductive.

The same exponential makes nᵢ ferociously temperature-sensitive: silicon's roughly doubles every 8–11 K near room temperature. That sensitivity is put to work in thermistors and betrays devices as leakage — a junction's reverse current rides on nᵢ or nᵢ², which is why hot electronics leak and why power devices must be derated with temperature.

The prefactor √(N_cN_v) collects the effective densities of states of the two bands — how many states each band offers within thermal reach of its edge — themselves T^(3/2) functions of temperature and effective mass. This page evaluates the nondegenerate equilibrium expression from the four entered parameters; choosing those parameters for a real material at a real temperature, and everything doping adds, lies outside it, as the scope note beside the result states.

What is intrinsic carrier concentration calculator?

The intrinsic carrier concentration nᵢ is the density of electrons (equal to the density of holes) present in a pure, undoped semiconductor at thermal equilibrium, given in the nondegenerate limit by nᵢ = √(N_cN_v)·exp(−E_g/2k_BT): the geometric mean of the conduction- and valence-band effective densities of states, discounted by half the band gap measured in thermal-energy units. For silicon at 300 K it is about 10¹⁰ cm⁻³ — tiny beside the 5×10²² atoms/cm³, and beside typical doping of 10¹⁵–10¹⁹ cm⁻³, which is exactly why doping controls silicon so decisively.

How to use this calculator.

  1. Enter N_c and N_v, the effective densities of states, in m⁻³ — silicon at 300 K uses 2.8×10²⁵ and 1.04×10²⁵ (handbook cm⁻³ values ×10⁶).
  2. Enter the band gap in eV at your temperature: 1.12 for Si, 0.66 for Ge, 1.42 for GaAs, 3.4 for GaN — gaps themselves shrink slightly as temperature rises.
  3. Enter the absolute temperature in kelvin; 300 K is the conventional ‘room temperature’ of datasheets.
  4. Read nᵢ in m⁻³ and divide by 10⁶ for the cm⁻³ units most literature quotes.
  5. For a T sweep, re-enter N_c and N_v scaled by (T/300)^1.5 as well as the new T — holding them fixed captures only the exponential part of the true temperature dependence.

The formula.

n_i = sqrt(N_cN_v) exp[-E_g/(2k_BT)]

In a nondegenerate semiconductor the electron density is n = N_c·exp(−(E_c−E_F)/k_BT) and the hole density p = N_v·exp(−(E_F−E_v)/k_BT): each band's effective states N discounted by how far the Fermi level sits from that band edge. Multiply them and the unknown Fermi level cancels — np = N_cN_v·exp(−E_g/k_BT), the mass-action law, valid doped or undoped. Purity adds the constraint n = p (every freed electron leaves one hole), and taking the square root yields nᵢ = √(N_cN_v)·exp(−E_g/2k_BT) — the half in the exponent exists because the gap's cost is shared between creating an electron and a hole. The mass-action law is also nᵢ's practical power: in doped material np = nᵢ² still holds, so knowing nᵢ and one carrier density immediately gives the other — the minority-carrier arithmetic underneath diode saturation currents and transistor gain. The engine evaluates the square root and exponential in Decimal arithmetic, rounding once to twelve significant digits; the exponential's argument uses k_B in eV/K so the entered eV gap divides cleanly.

A worked example.

Example

Take silicon's textbook parameters at T = 300 K: N_c = 2.8×10²⁵ m⁻³, N_v = 1.04×10²⁵ m⁻³, E_g = 1.12 eV. The thermal yardstick first: k_BT = 8.617×10⁻⁵ × 300 = 0.02585 eV. The exponent is therefore −E_g/2k_BT = −1.12/0.0517 = −21.66, and e⁻²¹·⁶⁶ ≈ 3.9×10⁻¹⁰ — the gap suppresses pair creation by ten orders of magnitude. The prefactor is the geometric mean of the band capacities: √(2.8×10²⁵ × 1.04×10²⁵) = 1.71×10²⁵ m⁻³. Multiplying: nᵢ = 1.71×10²⁵ × 3.9×10⁻¹⁰ ≈ 6.68×10¹⁵ m⁻³ — the engine's 6.6759×10¹⁵ — or 6.7×10⁹ cm⁻³. Set against silicon's 5×10²² atoms/cm³, thermal energy has freed roughly one electron per 10¹³ atoms; a modest phosphorus doping of 10¹⁶ cm⁻³ would outnumber these intrinsic carriers a millionfold, which is the entire premise of doped electronics.

valence Density States M310,400,000,000,000,000,000,000,000
absolute Temperature K300
conduction Density States M328,000,000,000,000,000,000,000,000
band Gap Ev1.12

Frequently asked questions.

Why does the band gap appear divided by 2k_BT rather than k_BT?
Because pair creation is a two-particle event whose cost the statistics split: the mass-action law np = N_cN_v·exp(−E_g/k_BT) carries the full gap, and the intrinsic condition n = p takes a square root of it, halving the exponent. Equivalently, the Fermi level sits near midgap in pure material, so each carrier type pays about E_g/2 to exist. Doped material re-tilts the split — but the np product keeps honouring the full-gap law.
How strongly does nᵢ depend on temperature?
Overwhelmingly, through the exponential: silicon's nᵢ roughly doubles every 8–11 K near 300 K, and between −40 °C and +125 °C — the automotive range — it moves by about six orders of magnitude. The prefactor adds a gentler T^1.5 per band. This sensitivity is why junction leakage soars in hot silicon, why thermal runaway is a real failure mode, and why ‘intrinsic temperature’ — where nᵢ overtakes the doping and a device forgets its design — caps every semiconductor's operating range.
Why can gallium nitride devices run hotter than silicon ones?
The band gap in the exponent. GaN's 3.4 eV versus silicon's 1.12 eV suppresses nᵢ by roughly e^(−(3.4−1.12)/0.0517) ≈ 10¹⁹ at room temperature — GaN's intrinsic density is around 10⁻¹⁰ cm⁻³, i.e. effectively zero carriers in any real crystal. The doping that defines a GaN device therefore stays dominant to far higher temperatures, which — together with high breakdown fields — is why wide-gap semiconductors own power electronics and hot environments.
What are N_c and N_v physically?
Effective densities of states: each collapses a band's full distribution of states, weighted by Boltzmann occupation, into a single equivalent density parked at the band edge. They scale as (m*k_BT)^1.5 — heavier effective mass and higher temperature both enlarge them — which is why silicon's N_c (2.8×10¹⁹ cm⁻³) exceeds its N_v-partner GaAs's N_c (4.7×10¹⁷): GaAs's conduction electrons are exceptionally light. They are computed or measured per material and tabulated at 300 K, then rescaled by (T/300)^1.5.
Does this formula still say anything once the material is doped?
Yes — through the mass-action law. Doping moves n and p individually but their product stays np = nᵢ² in equilibrium, so nᵢ computed here fixes the minority-carrier density that majority doping cannot touch: n-type silicon at N_D = 10¹⁶ cm⁻³ holds p = nᵢ²/n ≈ (6.7×10⁹)²/10¹⁶ ≈ 4,500 holes/cm³. Those scarce minority carriers govern diode saturation current and bipolar transistor action — nᵢ is small, but its square runs the device equations. The formula stops applying only in degenerate (very heavily doped) material, as the scope note records.

How this page was produced

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Method
n_i = sqrt(N_cN_v) exp[-E_g/(2k_BT)]
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